Fujitsu Limited and Fujitsu Laboratories Ltd. have successfully developed the world's first technology for growing a diamond film with highly-efficient heat dissipation on the surface of gallium nitride (GaN) high electron mobility transistors (GaN HEMTs), which are used in power amplifiers for technologies like weather radars and communications equipment.
Analog Devices, Inc., a leading global high-performance analog technology company, today announced that it has filed a patent infringement lawsuit against Xilinx, Inc. The lawsuit focuses on the unauthorized use by Xilinx of several important ADI patents relating to converter technology in at least two of Xilinx’s High End Zynq UltraScale+ RFSoC products.
Baylin Technologies Inc. (“Baylin”) today announced that its Kirkland, Quebec wholly owned subsidiary, Advantech Wireless Technologies Inc. (“Advantech”), has released a specialized filter which will prevent 5G base stations from interfering with C-Band satellite signals. The filter design has been extensively tested and is available for immediate shipment.
Cinch Connectivity Solutions, a Bel group company, and global leader in delivering reliable connectivity solutions, announces the expansion of the 2.92mm series with vertical launch, PCB compression mount connectors, that come with and without a side groove.
II‐VI Incorporated (Nasdaq: IIVI), a leader in engineered materials and compound semiconductors, today announced that it signed a multiyear agreement of over $100M, the largest in the history of II-VI, to supply silicon carbide (SiC) substrates for gallium nitride (GaN) RF power amplifiers deployed in 5G wireless base stations.
Small satellite manufacturer and mission services provider Blue Canyon Technologies (BCT) has purchased leading RF antenna manufacturer, Antenna Development Corporation (AntDevCo).
Passive Plus, Inc.’s brand new Capacitor Application Program (C.A.P.) helps Engineers and Designers select capacitors according to parameters such as cap value and frequency. C.A.P. will provide options (Case Size, Terminations, Mounting), and parameters (ESR, Q, Impedance) along with Datasheets.
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, introduced the Qualcomm Snapdragon 865 5G Mobile Platform, which combines the world’s most advanced 5G Modem-RF System with the world’s most advanced mobile platform designed to deliver the unmatched connectivity and performance required for the next generation of flagship devices.
Ranatec, a part of the Qamcom Technology AB group and specialist supplier of test and measurement equipment for RF and microwave applications, today announced it has added a new, state-of-the-art notch filter for RF test and measurement to its product portfolio.
Plus, T-Mobile flips the switch on its 5G network, Japan's KDDI teams with Facebook, an EU report sums up 5G concerns, and more, all in this edition of the Week in 5G.
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