IMS News

  1. AVX Showcasing Microwave & RF Component Solutions at IMS 2019
    5/30/2019

    AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, is showcasing its extensive portfolio of high-frequency, high-performance passive components optimized for microwave and RF applications extending across the automotive, consumer, telecommunications, military, and aerospace market segments at this year’s International Microwave Symposium (IMS 2019), which is taking place next week in Boston, Massachusetts. The conference begins on Sunday, June 2, and concludes on Friday, June 7, and the exhibition runs from Tuesday through Thursday, June 4–6.

  2. Anokiwave Showcasing 24/26 GHz ICs for 5G applications at IMS2019
    5/29/2019

    As the commercial launch of 5G services rapidly approaches and with the U.S. FCC Auction 102 (24 GHz Band) just completing – raising over $2B, Anokiwave is showcasing its portfolio of 24/26 GHz ICs for 5G applications at IMS2019 in Boston, MA, USA.

  3. Ultralow Jitter Clock Generation (4.5GHz) & Clock Distribution (7.5GHz) Family
    6/12/2018

    Analog Devices recently announced the LTC6952, LTC6953, LTC6955 and LTC6955-1 family of low jitter, high performance clock generation and distribution devices supporting JESD204B subclass 1 clocking applications up to 7.5GHz. 

  4. Pentek Introduces 766-Channel Software Radio Receiver For Surveillance And Wireless Applications
    6/12/2018

    Pentek, Inc., recently announced the newest member of its highly popular Jade family of high-speed data converter XMC FPGA modules: the 2-channel Jade Model 71865, a 200 MHz 16-bit A/D channelizer with 762 narrowband digital down converters (DDCs) and 4 wideband DDCs, based on the Xilinx Kintex UltraScale FPGA.

  5. FormFactor Announces Breakthrough Improvements In Productivity For RF Probe Systems
    6/12/2018

    FormFactor, Inc. (NASDAQ:FORM), a leading electrical test and measurement supplier to the semiconductor industry, today announced that it has extended its Contact Intelligence technology.

  6. Qorvo® Expands 5G Leadership With New 5G Infrastructure Solutions
    6/12/2018

    Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today introduced five new power amplifiers and front end modules that further expand its portfolio of RF products for massive MIMO and 5G base stations. These highly integrated, efficient, small-size modules support all frequency bands used for pre-5G and 5G architectures, from 3GHz to 39GHz.

  7. NXP Introduces New High Power RF Products For 5G Networks
    6/12/2018

    Semiconductors N.V. (NASDAQ:NXPI) is driving innovation with its expanded cellular infrastructure portfolio of GaN and silicon laterally diffused metal oxide semiconductor (Si-LDMOS) products that deliver industry leading performance in a compact footprint to enable next-generation 5G cellular networks.

  8. Qorvo® Introduces Ultra-Compact, GaN X-Band FEMs For Radar Applications
    6/12/2018

    Qorvo® (Nasdaq: QRVO), a leading provider of innovative RF solutions that connect the world, today introduced two very compact, high-performance, X-band front end modules (FEMs) designed for use in next-generation active electronically scanned array (AESA) radar. These export-compliant gallium nitride (GaN) products also meet the need for high RF power survivability essential for mission-critical operations.

  9. W. L. Gore & Associates Introduces New GORE-FLIGHT Microwave Assemblies, 6 Series
    6/12/2018

    W. L. Gore & Associates, Inc. (Gore) has introduced new GORE-FLIGHT Microwave Assemblies, 6 Series – lightweight cable solutions that deliver the lowest insertion loss before and after installation, ensuring reliable performance for the life of the system.

  10. W.L. Gore & Associates Introduces New GORE PHASEFLEX Microwave/RF Test Assemblies
    6/12/2018

    W. L. Gore & Associates (Gore) has introduced the new GORE PHASEFLEX Microwave/RF Test Assemblies, Type 0N for High Density Test/Interconnection – a lightweight assembly that ensures consistent, repeatable measurements with stable electrical performance up to 50 GHz.