Laminates

PRODUCTS AND SERVICES

Laminate For RF And Microwave Printed Circuit Boards: AD255C Laminate For RF And Microwave Printed Circuit Boards: AD255C
Arlon’s AD255C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD255C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
High-Frequency Laminates and Circuits
The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
AD1000: High Dielectric Constant Laminate AD1000: High Dielectric Constant Laminate
AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
AD350A: RF & Microwave Laminate AD350A: RF & Microwave Laminate
Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
RF And Microwave Laminates RF And Microwave Laminates
Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.
High Frequency Circuit Materials: RO4835™ High Frequency Circuit Materials: RO4835™

Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.

Laminate For RF And Microwave Printed Circuit Boards: AD300C Laminate For RF And Microwave Printed Circuit Boards: AD300C
Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
CLTE: RF & Microwave Laminate CLTE: RF & Microwave Laminate
CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
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